The continuous increase of product quality requirements in IoT, mobility and automotive markets are driving the need for upstream detection of silicon defects on integrated circuits, which are not otherwise identifiable via electrical test. This is a growing segment in semiconductor inspection with increasing volume of WLCSPs and advanced packaging.
Infra-Red imaging has the ability to see through silicon, inspecting the structure underneath the surface that is not otherwise observable with traditional vision inspection systems. Cohu’s new vision module offers a breakthrough by integrating infra-red imaging onto a high-speed automation platform that delivers an economical solution for high quality inspection. This new module, in combination with previously announced Aquilae inspection and 3D Flex metrology, further strengthens Cohu’s differentiation in the growing semiconductor inspection market.
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Jeffrey D. Jones, 858-848-8106