POWAY, Calif.--(BUSINESS WIRE)--Jul. 9, 2018--
Cohu, Inc. (NASDAQ: COHU), a leading supplier of semiconductor test and
inspection equipment, today announced the introduction of the new Infra-Red
Automated Optical Inspection (AOI) module for enhanced
micro-crack and sub-surface defect detection on wafer-level chipscale
packages (WLCSPs).
The continuous increase of product quality requirements in IoT, mobility
and automotive markets are driving the need for upstream detection of
silicon defects on integrated circuits, which are not otherwise
identifiable via electrical test. This is a growing segment in
semiconductor inspection with increasing volume of WLCSPs and advanced
packaging.
Infra-Red imaging has the ability to see through silicon, inspecting the
structure underneath the surface that is not otherwise observable with
traditional vision inspection systems. Cohu’s new vision module offers a
breakthrough by integrating infra-red imaging onto a high-speed
automation platform that delivers an economical solution for high
quality inspection. This new module, in combination with previously
announced Aquilae inspection and 3D Flex metrology, further strengthens
Cohu’s differentiation in the growing semiconductor inspection market.
Cohu will demonstrate the Infra-Red AOI module and other
innovative products during the SEMICON West show in San Francisco at
booth #5650 from July 10 to July 12, 2018.
About Cohu:
Cohu is a leading supplier of semiconductor test and inspection
handlers, micro-electro mechanical system (MEMS) test modules, test
contactors and thermal sub-systems used by global semiconductor
manufacturers and test subcontractors.
Forward-Looking Statements:
Certain matters discussed in this release, including statements
concerning Cohu's Infra-Red Automated Optical Inspection capability and
WLCSP segment growth are forward-looking statements that are subject to
risks and uncertainties that could cause actual results to differ
materially from those projected or forecasted. Such risks and
uncertainties include, but are not limited to, risks associated with our
ability to convert new products into production on a timely basis and to
support product development and meet customer delivery and acceptance
requirements for new products; our reliance on third-party contract
manufacturers and suppliers; failure to obtain customer acceptance
resulting in the inability to recognize revenue and accounts receivable
collection problems; revenue recognition impacts due to ASC 606; market
demand and adoption of our new products; customer orders may be canceled
or delayed; the concentration of our revenues from a limited number of
customers; intense competition in the semiconductor equipment industry;
our reliance on patents and intellectual property; compliance with U.S.
export regulations; geopolitical issues; the seasonal, volatile and
unpredictable nature of capital expenditures by semiconductor
manufacturers; and rapid technological change. These and other risks and
uncertainties are discussed more fully in Cohu's filings with the
Securities and Exchange Commission, including the most recently filed
Form 10-K and Form 10-Q, and in the Registration Statement on Form S-4
that has been filed by Cohu with the SEC containing a prospectus with
respect to the Cohu common stock to be issued in the proposed Xcerra
transaction and a joint proxy statement of Cohu and Xcerra in connection
with the proposed transaction that is contained therein. The
forward-looking statements included in this release are not assurances,
and speak only as of the date of this release, and Cohu does not
undertake any obligation to update these forward-looking statements to
reflect subsequent events or circumstances.
View source version on businesswire.com: https://www.businesswire.com/news/home/20180709005657/en/
Source: Cohu, Inc.
Cohu
Jeffrey D. Jones, 858-848-8106
Investor Relations