Growing demand for semiconductor integration with system-in-package and increasing quality requirements are driving the need for final test of integrated circuits post wafer singulation. These devices are essential in mobile and IoT consumer products where space constraints and functional requirements are paramount, as well as growing in automotive applications.
Luis A. Müller,
Forward Looking Statements:
Certain matters discussed in this release, including statements
concerning the introduction, features and performance of
Jeffrey D. Jones, 858-848-8106