POWAY, Calif.--(BUSINESS WIRE)--Jul. 13, 2015--
Cohu, Inc. (NASDAQ:COHU), a leading supplier of semiconductor test and
inspection handlers, announced today the introduction of 3D Flex Vision
system for Wafer Level Package (WLP) inspection. This new addition to
Cohu’s NVcore vision technology portfolio brings the benefits of
3-dimensional measurement equipment into the volume production
environment.
The 3D Flex Vision system is well suited for inspection of semiconductor
products used in mobility and wireless communications markets, such as
RF devices, small power management ICs and many other devices in Wafer
Level Packages (WLPs), one of the fastest growing technologies, today
representing nearly 20% of all 300 mm wafer-equivalent units, according
to Yole Développement.
Based on Moiré interferometry, the 3D Flex Vision system combines a
sequence of touchless 2-dimensional images with projected light patterns
to generate high accuracy 3-dimensional measurement of inspected
devices. This vision system generates a topographic view of devices,
accurately measuring ball or bump height, coplanarity, quality and body
warpage, enabling high-speed inspection of WLPs with micrometer
resolution. When integrated into Cohu’s turret handlers it can reach
production speeds of up to 30,000 units per hour.
About Cohu:
Cohu is a leading supplier of semiconductor test and inspection
handlers, micro-electro mechanical system (MEMS) test modules, test
contactors and thermal sub-systems used by global semiconductor
manufacturers and test subcontractors.
Forward Looking Statements:
Certain matters discussed in this release, including statements
concerning Cohu's 3D Flex Vision system are forward-looking statements
that are subject to risks and uncertainties that could cause actual
results to differ materially from those projected or forecasted. Such
risks and uncertainties include, but are not limited to, our ability to
convert new products under development into production on a timely
basis, support product development and meet customer delivery and
acceptance requirements for next generation equipment, failure to obtain
customer acceptance resulting in the inability to recognize revenue and
accounts receivable collection problems, our reliance on patents and
intellectual property, compliance with U.S. export regulations, and the
cyclical and unpredictable nature of capital expenditures by
semiconductor manufacturers. These and other risks and uncertainties are
discussed more fully in Cohu's filings with the Securities and Exchange
Commission, including the most recently filed Form 10-K and Form 10-Q.
Cohu assumes no obligation to update the information in this release.
View source version on businesswire.com: http://www.businesswire.com/news/home/20150713005220/en/
Source: Cohu, Inc.
Cohu
Jeffrey D. Jones – Investor Relations
(858) 848-8106